• This product is made of imported raw materials that are high-temperature and high-pressure resistant, ensuring no oil leakage. It meets the process requirements of flexible circuit board lamination and serves as a professional consumable for flexible circuit boards.

• It features rapid and uniform heat conduction, improving circuit board quality, enhancing production efficiency, saving energy, and reducing costs.

• With excellent cushioning and resilience, it prevents scratches caused by direct contact between the heating plate and the lamination board, thereby extending the lifespan of both.

Product Applications:

1. Suitable for the heat press bonding process of various display screens (TP, TN, TFT, OLED), such as FOG, COG, TAB, heat press conductive films, flexible circuit boards, and ITO conductive glass. It is placed at the bottom surface of the heat press head to conduct and buffer temperature, ensuring uniform heating while isolating the pressed product from the heat press head and providing anti-static insulation.

2. Thermal conduction for insulating semiconductors.

3. Cushioning, heat conduction, and sealing for aerospace equipment and high-end devices.

Product Features:

1. Exceptional thermal conductivity, heat resistance, and cushioning, ensuring no damage to FPCs, glass, etc.

2. Highly stable thermal properties and consistent pressure application.

3. Superior elasticity, non-stick surface, powder-free, and oil-free.

Product Specifications:

1. Product models: SIC-HG, SIC-HH, SIC-HB (black).

2. Common thickness: 0.2mm–0.45mm; length: 5mm–100mm; width: 5mm–580mm. Customizable sizes are available.